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October 1997

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Subject:
From:
Moss Dore <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 30 Oct 1997 09:41:31 +0000
Content-Type:
text/plain
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text/plain (21 lines)
On cross-sectioning a PWB, I'm finding voids between the metal of the SMT
pad and the main body of the epoxy filled via.
Its a typical resin filled via on a multilayer board.
Where or what are the specs for the voiding in the resin interms of size
etc. and the consequences of these voids?

Thanks in advance
Moss

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