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October 1997

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Subject:
FAB: BOARD SOLDERABILITY
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 29 Oct 1997 16:22:00 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (19 lines) 
We've been receiving some boards from our supplier which exhibit dewetting on
the surface mount pads.  The solder on the pads is much thicker on one end and
the balance (about 75%) is very thin.  We have had some non-wetting on the thin
portions during assembly.  The boards are HASLed, obviously the solder is blown
off in the direction of the thicker solder areas.  My question is this, what is
the fabricator doing wrong, and can these boards be reworked?

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