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October 1997

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Subject:
From:
sam mccorkel <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 29 Oct 1997 09:04:14 -0500
Content-Type:
text/plain
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text/plain (23 lines)
We've been using our hot air leveler to apply tin / lead for boards that
require a T/L finish. Our hal machine is vertical.

We're having trouble with boards that have large ground plane areas. The
solder isn't as flat as we need it to be. We'd like to know if anyone out
there has advise on what to adjust or if a different process is recommended.

I know this is a broad issue but would appreciate any comments.

Thank you!

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