TECHNET Archives

October 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet Mail Forum.
Date:
Tue, 28 Oct 1997 13:16:39 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
Hi Aric,
There is no "minimum safe thickness of a solder joint"; it all depends on the
total design and what you do with it. As a start look at IPC-D-279, Design
Guidelines for Reliable Surface Mount Technology Printed Board Assemblies.
There is also a huge difference if you have "a solder joint between 2 plates
and/or a butt joint." With plates you may have to worry about the local
expansion mismatch, whereas butt joints have been shown to much less reliable
than either J-lead or gullwing joints, everything else being equal as work by
both Northern Telecom and Motorola has shown.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2