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October 1997

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Subject:
From:
"Maguire, James F" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 3 Oct 1997 09:17:07 -0700
Content-Type:
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text/plain (83 lines)
We hard wire teflon coated wires to pads.  Our preference is to solder
the wires during the test PWA assembly (as opposed to a seperate
"wiring" solder operation"; in this case we solder in a short,
uninsulated bus wire and then crimp to test leads after using teflon
insulated crimp lugs.

When we do wire after assembly we apply conformal coating (all our
testing is condensing and thus coating used) and then solder with use R
flux and IPA swap (no rinsing, it may spread contaminate).

We have used edge connectors but found problems with leakage,
contamination, and the extra cost of getting gold plated edge contacts
and connector contacts.  (using sn or solder plated contacts we had
oxidation which caused reading to appear good (high) when in fact it was
just a current loss at contact.  Also we've seen mixing of gold/solder
(e.g. Au contact to solder plated pad) -> galvanic corrosion which
toasts the test.

Jim

Jim.
===============================
Jim Maguire
Senior Principal Engineer
Boeing Defense & Space Group
PO Box 3999  M/S 3W-97
Seattle, WA  98124-2499
Phone (206)657-9063     Fax 657-8903
Email:  [log in to unmask]
================================

> ----------
> From:         Doug Pauls[SMTP:[log in to unmask]]
> Reply To:     TechNet Mail Forum.;[log in to unmask]
> Sent:         Tuesday, September 23, 1997 8:40 AM
> To:   [log in to unmask]
> Subject:      [TECHNET] SIR Testing
>
> Good Morning All,
>
> A quick survey, if you don't mind.  For those of you who do SIR
> testing
> in-house, do you use hard wiring, i.e. soldering individual wires to
> test
> points, or do you use edge card connectors, or some other attachment
> method?
>
>
> I ask the question because this may be one area that the IPC SIR task
> group
> will examine in the future.
>
> Doug Pauls
> CSL.
>
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