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October 1997

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Subject:
Re: TEchnet
From:
Valli Robert <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 3 Oct 1997 12:00:00 -0400
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text/plain
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text/plain (13 lines) 
We have seen similar problem caused by smt component reflow during
selective wave soldering.  Have you done thermal profiling of your
product through all of your processes to verify that topside board
temperatures of fine pitch smt components during wave solder do not
cause secondary reflow of the soldered connections?

RAV
 ----------
From: Martin Bourke
To: [log in to unmask]
Subject: TEchnet

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