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October 1997

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Subject:
From:
"(George Milad)" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 28 Oct 1997 09:38:35 -0500
Content-Type:
text/plain
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text/plain (33 lines)
The difference between Immersion, electroless and electrolytic.
The deposition of a metal from solution involves ar eduction process, this
can be accomplished by one of the following methods:
Immersion:
Here the reduction is acheived by the oxidation of the metal substrate, for
example copper would go into solution as Pd is deposited on the surface when
the surface is completely covered the reaction stops, it is a self limiting
process.
Electroless:
In this process the reduction is carried by a reducing agent that is part of
the chemical process, example is formaldehyde in electroless copper and
Sodium hypophoshite in electroless nickel. The reation is sustained by the
chemistry and may continue endlessly.
Electrolytic:
Electrolytic reduction is supplied by the use of rectifiers. Bussing or
connectivity is a must for electroplating.

George Milad
Technical Marketing Mgr
LeaRonal Inc.

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