LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

October 1997

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET October 1997

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials
From:	Jack Crawford <[log in to unmask]>
Reply To:	TechNet Mail Forum.
Date:	Fri, 24 Oct 1997 15:06:17 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (31 lines)

Reposted due to line wrap problems on the first go-a-round. My apologies.

This is an invitation to comment to all IPC members and other interested parties.

IPC Task Group 5-24d "Direct Chip Attach Adhesives" is continuing work on the component underfill document P-116 originally drafted by a working group led by Ken Gilleo (Alpha Metals). This document has transitioned to a full effort for this task group being chaired by Larry Crane (Loctite) and Ken is continuing support as vice-chair. The document has ben assigned the number and title J-STD-030 "Qualification and Performance of Flip Chip Underfill Materials."

The draft of J-STD-030 more closely resembles a "use and qualification guideline" than a standard. The task group is questioning whether it will be of most value to users to continue with the softer words of a guideline, or to include "standard" words also. Is this technology still too now to be put into a "standard"? If you are a potential user of this document, please share your thoughts with us.

The draft document is available for review and comment. Anyone interested in doing so should contact me OFF THE TECHNET. I'll pass the comments along to the task group.

The task group will be meeting to continue work on this document during the IPC Interim Meetings in Tempe AZ. This TG is tentatively scheduled for 8:00-5:00 two days Tues Jan 20 and Wed Jan 21. There is plenty of room for anyone wishing to join this group and assist with development of the document.

Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL 60062-6135
[log in to unmask] http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2

LISTSERV.IPC.ORG