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October 1997

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Fri, 24 Oct 1997 20:41:29 -0700
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Roger Hammond wrote:
>
> Scott wrote
> >   >>
> > Ken
> > Why the tolerance of +0, -8 instead of +0, -13.  It should be ok to plate or solder coat the hole shut.  It is not a piece of cake but is doable by a reliabl
> Find out their aspect ratio for drill capabilities, desmear or etchback process, and
> electroplated copper elongation %.  Find out if they are using air bearing spindles at
> drilling if they have vibration on their electroless line.
> >              I agree why not fill the holes.
>
>         Why is it assumed that small hole plating is achieved with old technology I.E.
> electroless copper? There are people out there who can and do manufacture  16:1 aspect
> ratios in high layer count boards using direct plate systems.( 14 layers in 62 mil and
> 24 layers 120 mil) These are the guys you should be talking to. They have already
> invested for the 21st. century. Floating shields are than than vibrators in electrolytic copper and pulse plating gives better throwing power.
>


> Roger Hammond

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