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Subject:	ASSY: J-STD-030 Qualification and Performance of Flip Chip Underfill Materials
From:	Jack Crawford <[log in to unmask]>
Reply To:	TechNet Mail Forum.
Date:	Fri, 24 Oct 1997 12:35:33 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (30 lines)

This is an invitation to comment for all IPC members and other interested parties.

IPC Task Group 5-24d "Direct Chip Attach Ahesives" is continuing work on the component underfill document P-116 drafted by a working group led by Ken Gilleo (Alpha Metals). This document has transitioned to a full effort for this task group chaired by Larry Crane (Loctite) and Ken is supporting as vice-chair. The document has been assigned the number and title J-STD-030 Qualification and Performance of Flip Chip Underfill Materials.

The draft of J-STD-030 more closely resembles a "use and qualification guideline" than a standard. The task group is questioning whether it will be of most value to users to continue with the softer words of a guideline, or to include "standard" words also. Is this technology still too new to be put into a "standard"?

The draft document is available for review and comment. Anyone interested in doing so should contact me OFF THE TECHNET. I'll pass the comments along to the task group.

The task group will be meeting to continue work on this document during the IPC Interim Meetings in Tempe AZ. The meeting is tentatively scheduled for 8:00-5:00 for two days Tuesday Jan 20 & Wednesday Jan 21. There is adequate room in this task group for anyone wishing to participate to assist with development of this document.

Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL 60062-6135
[log in to unmask] http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

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