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October 1997

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 23 Oct 1997 17:15:14 -0500
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Hi Rob - I went digging through my files and found a reference made by
Klein Wassink that recommended  the Zinc level be limited to less than
0.005% due to it causing drossing, grittiness, and grain boundary weakening
(ok, solder colony weakening for those who don't like the words grain
boundary and solder in the same sentence). I couldn't find anything on
Cobalt, I don't have a Sn-Co phase diagram and the Pb-Co phase diagram
shows that lead and cobalt don't like each other at all. Hope this helps.
Did you have a suspected contamination issue?

Dave Hillman
Rockwell Collins
[log in to unmask]





[log in to unmask] on 10/20/97 10:56:31 AM

Please respond to [log in to unmask]; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TECHNET] Assembly




Hi Technet,
        Does anyone have information regarding the maximum percentage of
cobalt and
zinc that are permissible in a Sn-Pb solder joint?  Thanks in advance for
any
answers.
        Rob Schetty
        LeaRonal Inc.
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