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October 1997

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Subject:
From:
"Niewiemski, Dwayne" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 1 Oct 1997 08:00:07 -0400
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I am considering to switch the plating used on our PCB's from HASL to
gold immersion.  The reason I am considering making this change is to
improve the solder joint reliability of our 20mil components.

My company is a manufacture of RF products from 300MHz to 2.4GHz. When I
switch to gold immersion plating is there any electrical characteristics
I should be concerned about between gold immersion and HASL.  Is there
any types of testing I should do to verify I did not change the
performance of my products.

Any information would be helpful.


Thank you for you time.


Dwayne Niewiemski
Director of Manufacturing Engineering
Microwave Data Systems
Rochester, New York

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