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October 1997

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 23 Oct 1997 16:25:16 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (80 lines)
Bryan,
See below.

>----------
>From:  Bryan Woods[SMTP:[log in to unmask]]
>Sent:  Thursday, October 23, 1997 12:41 PM
>To:    [log in to unmask]
>Subject:       [TN] Wave soldering SMD actives
>
>Because of top side board space constraints, we are considering wave
>soldering some active SMD components (SOICs, etc.) on the bottom side of
>our boards for the first time.  They would potentially be glued onto the
>board via an epoxy dispenser with screened solder paste and then run
>through our wave solder.  I am very interested to hear what
>problems/solutions were encountered by others trying to go down this path.
>Issues of specific interest to me are:
>
>Nitrogen environment or free air?
Nitrogen at the wave.
>Thieving pads?
Don't know, I'm a "lab rat" and only know bits and pieces.
>Fluxes being used (no clean/water wash)?
No-clean.  CAUTION If you use a wash wash based flux you had better hope
that your parts are REALLY hermetic or you are going to have big
problems.
>What kind of pitches/sizes of components?
SOIC20, 28's
>Thermal degradation of components?
Never saw this, except for one batch of resistor networks where the
supplier messed up and used eutectic solder for the internal
connections.  (Melted and shorted out all the resistors.)
>Any else?
Leads must be parallel to direction of board travel.

Hope this helps.

Bev Christian, PhD
Manager, Materials Engineering Lab
Nortel
613-967-5407
>
>Thanks in advance.
>
>
>Bryan Woods
>Manufacturing Engineer
>
>Parker Hannifin                 |  Phone: (707)584-2542
>Compumotor Division             |  Toll free: (800) 358-9068, ext 2542
>5500 Business Park Drive        |  FAX:   (707)584-8015
>Rohnert Park,CA   94928 |  Email: [log in to unmask]
>                                |  Web site: http:\\www.compumotor.com
>
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