Sorry for the late response.
You are reading it correctly.

 As it stands now lifted lands are allowed after thermal stress without
limit.  The intent of 3.3.4 is to not allow pad lift in the "as
received" condition which is a visual examination  only.  An  "as
received" microsection is not a requirement.  The 6012 committee has
discussed this issue some and need to hear from the assembly folks.  As
it stands now the J-001B spec does have a limit to pad lift.

..... as Mike B. had quoted [J-STD-001B (9.2.1.1) states that "When the
outer, lower edge of the land areas are lifted or separated more than
the thickness (height) of the land" the PWB must be rejected. ]

The potential problem is that you could have boards that pass 6012 but
could fail at next assembly after soldering due to excessive pad lift,
i.e.,  beyond the plated copper/coatings plus clad copper height which
is typically .003" depending on the starting clad copper weight.   I
believe this is similar to the old problem from years back where 55110
allowed .001" and the old first version of MIL-STD-2000 did not allow
any pad lift.

We need to hear from the assembly folks as to their concerns and if
J-001 should be amended to allow pad lift with out limit to match 6012.
The other option would be to place a limit at 6012 that matches J-001.

I'm sure one of the biggest concerns within the assembly group relates
to cleaning the  entrapments  from the blind areas under the lifted
lands so they can pass cleanliness requirements.

I would love to hear some opinions and please also respond to the 6012
committee by way of the "Standard Improvement Form" through Lisa
Williams at the IPC.

Thanks
Don Dupriest
Lockheed Martin Vought Systems
 ----------
From: APeder01
To: [log in to unmask]
Subject: [TECHNET] Lifted Lands per IPC-6012