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October 1997

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 23 Oct 1997 13:28:47 -0400
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Dave, Sheila,
Although soldering irons can certainly melt the 95/5 solder isn't there
an increased risk of damage to the board because of the application of
the higher temperature to the FR-4?
Bev Christian
Nortel
[log in to unmask]

>----------
>From:  David D Hillman[SMTP:[log in to unmask]]
>Sent:  Thursday, October 23, 1997 11:59 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] [TECHNET] ASSY: Solder compatibility
>
>Hi Sheila - a  question - do you know that the voids are detrimental to
>solder joint reliability? Also mixing of 95/5 with Sn62 is probably not
>going to give you an intermetallic issue but you will probably get a
>reeeaallly neat solder joint composition which will be very hard to predict
>any type of properities data or even a simple melting point. If you must do
>touchup why not use 95/5 as the touchup alloy? Soldering irons can melt
>that alloy.  Good Luck.
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
>
>[log in to unmask] on 10/21/97 10:05:36 AM
>
>Please respond to [log in to unmask]; Please respond to [log in to unmask]
>
>To:   [log in to unmask]
>cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
>Subject:  [TECHNET] ASSY:  Solder compatibility
>
>
>
>
>Hello TechNet ..
>Does anyone have any experience with possible intermetallics formation if I
>use Sn62Pb362Ag to touchup voids in a Vapor phase reflowed Sn95Sb5 solder
>joint ???  Especially after 100 temp cycles from -55C to 120C?  Thanks for
>any help!
>Sheila Smith, Tracor AES
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