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October 1997

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Subject:
From:
Paul Gould <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 23 Oct 1997 18:16:42 +0100
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Rob van Pol wrote:-
>We have tried peelable solderresists but these are not 100 %
>resistant to the pressure during horizontal hot air levelling resulting
>in P/Sn particles on the Ni/Au contacts.
Hi Rob,

You are on the right track with peelable but maybe you are not coating
sufficient thickness. You really need a very thick coating of around 20
mils to be able to withstand the levelling air knives. I have no
experience of horizontal levelling but it must be much the same as
vertical to the peelable.

There are other types of water soluble non-peelable masks if you want to
get into more water washing. Fortunately, I have not needed to go that
far and so again have no experience of these. Stick with the peelable
method and try to make it work.

Good luck,
--
Paul Gould
[log in to unmask]
Isle of Wight,UK

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