I have read IPC-4202 - Assembly Process Preconditioning for Qualification of
Components, and have a few questions about wave solder profiling.  I was
hoping that someone may provide some insight.

Specification Questions
1.   Should wave solder profiling be done with a soldered board or
unsoldered board?
2.   In selection of the location of the thermal couples, should any
consideration be given to the hot/cold locations on the
     board?
3.   What is the optimal solder pot temperature?

I can be reached at :

Kirk Van Dreel
585 Enterprise Drive
P.O. Box 529
Neenah, WI 54957
Phone: (920)720-6651
Fax: (920)720-6702
Email: [log in to unmask]

Thanks,
Kirk

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