Because of top side board space constraints, we are considering wave
soldering some active SMD components (SOICs, etc.) on the bottom side of
our boards for the first time.  They would potentially be glued onto the
board via an epoxy dispenser with screened solder paste and then run
through our wave solder.  I am very interested to hear what
problems/solutions were encountered by others trying to go down this path.
Issues of specific interest to me are:

Nitrogen environment or free air?
Thieving pads?
Fluxes being used (no clean/water wash)?
What kind of pitches/sizes of components?
Thermal degradation of components?
Any else?

Thanks in advance.


Bryan Woods
Manufacturing Engineer

Parker Hannifin                 |  Phone: (707)584-2542
Compumotor Division             |  Toll free: (800) 358-9068, ext 2542
5500 Business Park Drive        |  FAX:   (707)584-8015
Rohnert Park,CA   94928 |  Email: [log in to unmask]
                                |  Web site: http:\\www.compumotor.com

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