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October 1997

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Subject:
From:
Lainie Loveless <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 23 Oct 1997 11:10:33 -0500
Content-Type:
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text/plain (24 lines)
Does anyone have any info quantifying board baking prior to reflow
and wave soldering?  Temps/ lengths of time @...?  Also, does anyone
have the scenario where a board is misprinted (solder paste), is sent
thru a cleaner (in-line) and is then re-printed for placement.  Do
you re-bake and at what time/temp's?

Thanks in advance!
Lainie Loveless
General Atronics Corp
Wyndmoor, PA
(215) 242-7336

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