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Subject:	Re: [TECHNET] ASSY: Solder compatibility
From:	David D Hillman <[log in to unmask]>
Reply To:	TechNet Mail Forum.
Date:	Thu, 23 Oct 1997 10:59:54 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (59 lines)

Hi Sheila - a  question - do you know that the voids are detrimental to
solder joint reliability? Also mixing of 95/5 with Sn62 is probably not
going to give you an intermetallic issue but you will probably get a
reeeaallly neat solder joint composition which will be very hard to predict
any type of properities data or even a simple melting point. If you must do
touchup why not use 95/5 as the touchup alloy? Soldering irons can melt
that alloy.  Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]





[log in to unmask] on 10/21/97 10:05:36 AM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TECHNET] ASSY:  Solder compatibility




Hello TechNet ..
Does anyone have any experience with possible intermetallics formation if I
use Sn62Pb362Ag to touchup voids in a Vapor phase reflowed Sn95Sb5 solder
joint ???  Especially after 100 temp cycles from -55C to 120C?  Thanks for
any help!
Sheila Smith, Tracor AES
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