For hole wall preparation plasma etching is used nowadays to avoid potential chemical hazards.The following
plasma etch cycle has been used successfully by several fabricators. Please bear in mind that every plasma
chamber has subtle differences. This factor combined with variations in laminate thickness, resin content and
hole diametere make it challenging to provide a fool-proof cycle. Please use following recommendation as a
starting point:

        Stage 1: O2, 50 % at 4300 Watts RF and 250 psi for 10 minutes
        Stage 2: He 100 % at 2575 Watts RF and 250 psi for 15 minutes. End point temperature is 175 Deg F.

Regards

Manfred Huschka
Taconic

--- On Tue, 21 Oct 1997 13:41:57 -0500  Ed Cosper <[log in to unmask]> wrote:
Does this material process the same as standard FR 4 with respect to desmear and electroless?
All help is appreciated.

Ed Cosper
Graphic Electronics

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---------------End of Original Message-----------------

--------------------------------------------------------
Name: Manfred Huschka
Taconic Advanced Dielectric Division, Lynn Industrial Park, Mullingar,
Co. Westmeath, Republic of Ireland
Office: PF 1275, D-51676 Wipperfuerth, Germany; Tel.: +49 2267 888004,
Fax:+49 2267 888005
E-mail: Manfred Huschka <[log in to unmask]>