Fellow Technetters,

At present we use a screenable laquer from Lackwerke Peters
(Werner Peters SD 2955) to cover inboard Ni/Au (hardgold)
contacts/connectors during horizontal hot air levelling.

In a few months however we are not allowed to use the fluid to strip
this laquer anymore, due to enviromental reasons.

We have tried peelable solderresists but these are not 100 %
resistant to the pressure during horizontal hot air levelling resulting
in P/Sn particles on the Ni/Au contacts.

Manual taping is also no option volumewise.

# Which materials/processes are available for manufacturers which
   use horizintal HASL to cover, in medium/high volume, inboard
   Ni/Au contacts before HASL?

Any thoughts on the subject or any other alternatives would be
appreciated.

Thanks,


Rob van Pol
MOMMERS PRINT SERVICE B.V.

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