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October 1997

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Subject:
From:
George Franck <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 21 Oct 1997 18:06:40 -0400
Content-Type:
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text/plain (62 lines)
Jack,
There are two common choices.  Chlorine Gas, or Hydrogen Peroxide.
When properly controlled, neither are a problem.  However, if there is a
problem, and eventually there is...
1) Chlorine gas can leak into the area.  This is a toxic gas, which can be
deadly.  You get a leak, you evacuate the building.  Been there, done that.
2) Hydrogen Peroxide, if etchant gets syphoned back into the Peroxide
container, the copper will cause the peroxide to break down.  This will
release heat, and create pressure.  I have known of a barrel to blow up!
Also, a slow peroxide leak is dangerous.  Over time, the water in the
peroxide evaporates, and the peroxide concentrates.  Once during
maintenance, an operator (wearing gloves) wiped up a peroxide spill with a
paper towel.  The towel smoked and burst into flames.  The operator refused
to work in the area again!

I would still choose the peroxide again, and also use it in the micro-etch
also.

George Franck
My opinions are just that.
----------
> From: Jack Evans <[log in to unmask]>
> To: [log in to unmask]
> Subject: [TECHNET] Cupric Chloride Etchant
> Date: Tue, 21 Oct 1997 10:12:23 -0700
>
>Good Morning Everyone,
>
>We are in the process building a new inner layer facility and are
>considering using Cupric Chloride etchant. Does anyone out their have
>any suggestion on the safest, cleanest way to control the process ?
>
>Any suggestions would be appreciated.
>
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