Hello, Technetters!
I need infomation about Tombstoning of Surface mount components during
Reflow.
Does it occure on leadless components in general, disregarding size and
number of connections?
If so, what are the rules for avoiding it?-Design of pads?
We encounter a problem which seems to be tombstoning with components
featuring 3+3 terminations .The corresponding pads on one side are
connected
to large conductor areas. The others are not. After reflow many
components are tipped on one side or misplaced.
Any suggestions?
Thank you,
Gaby

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