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October 1997

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Subject:
From:
Sheila Smith <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 21 Oct 1997 11:05:36 -0400
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Hello TechNet ..

Does anyone have any experience with possible intermetallics formation if I
use Sn62Pb362Ag to touchup voids in a Vapor phase reflowed Sn95Sb5 solder
joint ???  Especially after 100 temp cycles from -55C to 120C?  Thanks for
any help!

Sheila Smith, Tracor AES

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