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October 1997

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Subject:
From:
Fulton Feng <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 20 Oct 1997 19:27:32 -0400
Content-Type:
text/plain
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text/plain (30 lines)
Thank you , Doug !

>----------
>From:  Doug Pauls[SMTP:[log in to unmask]]
>Sent:  Monday, October 20, 1997 7:36 AM
>To:    [log in to unmask]
>Subject:       Re: [TECHNET] Brittle Solder Joints N
>
><<File: LAY2W60.txt>>
>Fulton,
>The attached file is in Word 6.0 format.  You may need to MIME decode the
>document if your e-mail reader does not do this automatically.  If you can't
>read it, I will send a paper copy.
>
>Doug.
>
>

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