Hi John and Jos --
I have been investigating AOI for the past several months. I've been to visit
two vendors in hopes of seeing a demonstration of their equipment's ability to
inspect post-reflow solder joints on my board. The board in question has around
4000 solder joints, and at least 100 different component types, QFP132's, SOT's,
20 mil TSOP's, 0805's, etc. Neither vendor has yet been able to show me that
their equipment can handle this ... but it does look feasible, given enough
"debug" time.
On the more optimistic side, I've also visited two customers of these vendors,
both of whom are very, very pleased with the equipment. One customer is using
the equipment pre-reflow, to monitor actual part placement measurements. My
impression is that pre-reflow AOI is quite a bit more robust and easier to do
than post-reflow. Another customer is inspecting post-reflow, and claims that
the equipment has allowed them to increase their yields by close to 30 yield
points. However, these are very simple boards with only a few, very standard
components.
Please feel free to contact me off-Technet to discuss further. I would be very
interested in hearing about any other replies you get to your inquiries.
Vickie Chapman
Fluke Corporation
425-356-5030
On Mon, 20 Oct 1997 19:20:47 -0700 [log in to unmask] wrote:
> From: [log in to unmask]> Date: Mon, 20 Oct 1997 19:20:47 -0700
> Subject: Re: [TECHNET] Automated Inspection Equipment
> To: [log in to unmask]
>
> Address,
>
> Adding to Jos query. Is anyone currently using AOI following Reflow
> to check solder joints for opens, shorts and component
> placement/alignment? If so, how successful has using AOI been for
> you? Basically what pros and cons can anyone offer.
>
> Thanks,
>
> John Gulley
> Inet Inc.
> 972-578-3928
> www.inetinc.com
>
>
>
> ______________________________ Reply Separator
_________________________________
> Subject: [TECHNET] Automated Inspection Equipment
> Author: Jos Aarninkhof <[log in to unmask]> at Internet
> Date: 10/20/97 9:52 AM
>
>
> Fellow Technetters,
>
> As a contract assembler we are in need, for a new client, of an piece of
> equipment to measure the exact position of a specific (SMD) component on
> a populated board.
> Is there any input concerning this issue?
> On vendors who sell this equipment and experience with this kind of
> measurements?
> The equipment should ideally also be suited for inspection on solder
> joints and placement of components etc. It is not necessary that it can
> work in-line because the measurement of the position of the component is
> done by sampling.
>
> Many thanx in advance for any input.
>
> Jos Aarninkhof
> SPA Nedworks Almelo
> Netherlands
> Email (at work): [log in to unmask]
>
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