Dan
Can you mail or fax copy to me as well.


Thanks in advance.


[log in to unmask]

Unisys Canada Inc.
51 Burmac Road
Winnipeg R2J4C9
CANADA
PH: 204-257-9199
FAX 204-257-9104

> ----------
> From:         Fulton Feng[SMTP:[log in to unmask]]
> Sent:         October 17, 1997 7:13 PM
> To:   [log in to unmask]
> Subject:      Re: [TECHNET] Brittle Solder Joints N
>
> Dan
> Could you fax me a copy of the paper too? I am very interested in it.
>
> Thanks in advance!
>
> Fulton Feng
> Nortel
> Enterprise Network
> Santa Clara, Ca 95052-8173
> Tel:408-565-2266
> Fax:408-565-8460
>
> >----------
> >From:  Dan Babcock[SMTP:[log in to unmask]]
> >Sent:  Wednesday, October 15, 1997 3:56 PM
> >To:    [log in to unmask]
> >Subject:       Re: [TECHNET] Brittle Solder Joints N
> >
> >Hi Christina -- The paper entitled 'Effect Of Au On The Reliability
> Of
> >Fine Pitch Surface Mount Solder Joints" from the 1991 SMI Proceedings
> may
> >provide some helpful information. I can Fax a copy if you'd like.
> >
> >Dan Babcock
> >Sr. Engineer
> >Maxtor Corp
> >[log in to unmask]
> >
> >>Subject: Brittle Solder Joints
> >>
> >>Hello,
> >>
> >>I am looking for some information either from experience or papers
> on
> >>what causes brittle solder joints.  We have immersion gold over
> nickel
> >>and use eutectic solder paste. Board material is high-temp FR4.   I
> >>would like to know:
> >>
> >>1.  How many heat cycles a solder joint will tolerate without
> becoming
> >>brittle.  Is there a temp that a solder joint becomes brittle and
> the
> >>crystalline structure changes (as in steel tempering)?
> >>2.  What would be the definition of a heat cycle (would it be
> reaching
> >>183 C or something else)?
> >>3.  What is a safe temp to have boards at  during a stress testing..
> >>
> >>any information or a contact to find information would be greatly
> >>appreciated.
> >>Thanks in advance for your help,
> >>
> >>Christina Piasky ([log in to unmask])
> >>Sequent Computer Systems
> >
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