Hi,
I'd like to have some enquiries on PCB board - FR4 material.
Firstly, what's the temp that FR4 can withstand?
Secondly, what's the cause for pad peeling (the pad are gold flash)? Will
the parameter of the the chemical causes the plating to peel off easily?
Thirdly, is there any solution to resolve when pads are found 'floating'
when mounted with components?
Lastly, do you have any technical specification  for FR4 material.
Looking forward to hearing from you soon.
Thanks & best Rdgs.
YL
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