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Reply To: | TechNet Mail Forum. |
Date: | Fri, 17 Oct 1997 20:13:07 -0400 |
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Dan
Could you fax me a copy of the paper too? I am very interested in it.
Thanks in advance!
Fulton Feng
Nortel
Enterprise Network
Santa Clara, Ca 95052-8173
Tel:408-565-2266
Fax:408-565-8460
>----------
>From: Dan Babcock[SMTP:[log in to unmask]]
>Sent: Wednesday, October 15, 1997 3:56 PM
>To: [log in to unmask]
>Subject: Re: [TECHNET] Brittle Solder Joints N
>
>Hi Christina -- The paper entitled 'Effect Of Au On The Reliability Of
>Fine Pitch Surface Mount Solder Joints" from the 1991 SMI Proceedings may
>provide some helpful information. I can Fax a copy if you'd like.
>
>Dan Babcock
>Sr. Engineer
>Maxtor Corp
>[log in to unmask]
>
>>Subject: Brittle Solder Joints
>>
>>Hello,
>>
>>I am looking for some information either from experience or papers on
>>what causes brittle solder joints. We have immersion gold over nickel
>>and use eutectic solder paste. Board material is high-temp FR4. I
>>would like to know:
>>
>>1. How many heat cycles a solder joint will tolerate without becoming
>>brittle. Is there a temp that a solder joint becomes brittle and the
>>crystalline structure changes (as in steel tempering)?
>>2. What would be the definition of a heat cycle (would it be reaching
>>183 C or something else)?
>>3. What is a safe temp to have boards at during a stress testing..
>>
>>any information or a contact to find information would be greatly
>>appreciated.
>>Thanks in advance for your help,
>>
>>Christina Piasky ([log in to unmask])
>>Sequent Computer Systems
>
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