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October 1997

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Subject:
From:
Fulton Feng <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 17 Oct 1997 20:13:07 -0400
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Dan
Could you fax me a copy of the paper too? I am very interested in it.

Thanks in advance!

Fulton Feng
Nortel
Enterprise Network
Santa Clara, Ca 95052-8173
Tel:408-565-2266
Fax:408-565-8460

>----------
>From:  Dan Babcock[SMTP:[log in to unmask]]
>Sent:  Wednesday, October 15, 1997 3:56 PM
>To:    [log in to unmask]
>Subject:       Re: [TECHNET] Brittle Solder Joints N
>
>Hi Christina -- The paper entitled 'Effect Of Au On The Reliability Of
>Fine Pitch Surface Mount Solder Joints" from the 1991 SMI Proceedings may
>provide some helpful information. I can Fax a copy if you'd like.
>
>Dan Babcock
>Sr. Engineer
>Maxtor Corp
>[log in to unmask]
>
>>Subject: Brittle Solder Joints
>>
>>Hello,
>>
>>I am looking for some information either from experience or papers on
>>what causes brittle solder joints.  We have immersion gold over nickel
>>and use eutectic solder paste. Board material is high-temp FR4.   I
>>would like to know:
>>
>>1.  How many heat cycles a solder joint will tolerate without becoming
>>brittle.  Is there a temp that a solder joint becomes brittle and the
>>crystalline structure changes (as in steel tempering)?
>>2.  What would be the definition of a heat cycle (would it be reaching
>>183 C or something else)?
>>3.  What is a safe temp to have boards at  during a stress testing..
>>
>>any information or a contact to find information would be greatly
>>appreciated.
>>Thanks in advance for your help,
>>
>>Christina Piasky ([log in to unmask])
>>Sequent Computer Systems
>
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