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October 1997

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Subject:
Re: Heatsink lamination
From:
Steves <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 17 Oct 1997 10:44:07 +0000
Content-Type:
text/plain
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text/plain (20 lines) 
Before I can truly understand your situation and offer any advise, I
will need a bit more information.  What is the thickness of the bare
board?  What is the thickness of the heatsink?  Are you bonding to
bare laminate, or soldermask?  If it is soldermask, what type of mask
is it?  (LPI, WET, DRY FILM)  Are you restricted in the amount of
bonding material you will use because of an overall thickness
tolerance?  Is the board Hot Air Leveled or Reflowed Tin lead?

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