Hello Net members

I tried this quistion at the specific IPC-SM-840 Forum, but only got one reply. Hope TechNet are more "alive" on this issue !!

We are right now going though the c revision of the standard, and have found some "muddy" places in the tekst.

Does someone have some sort of a official or unofficial list of know errors in the IPC.SM-840 standard ???  And perhaps a posibly correction !?
If so.... I would just loooove to have a copy !!

Thanks in advance !!

Here are some of mine own findings :

ex: 3.9.3 Thermal shock. 
The text calls out for soldering speciments before testing, but table 10 only suggest a sample tested before soldering. !!??

and this:
3.9.2  Electrochemical Migration
Table 5 specifies class T conditions 85*C/85%Rh while  IPC-TM 650  test method 2.6.14 (rev B) in paragraph 5.1 specifies class T conditions 85*C/90%Rh 

And there is properbly more of the same stuff, if I keep looking !!

Lars L Holm.
Quality Engineering
Printca AS. Denmark.
Email: [log in to unmask]

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