Hi Rich,
What you are asking for has been done in IPC-TR-484, "Round Robin Reliability
Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards."
An update of the formulas used can be found in Appendix B of IPC-D-279,
"Design Guidelines for Reliable Surface Mount Technology Printed Board
Assemblies".  For even more information, you could attend my workshop
"Design, Manufacturing and Reliability Issues of
Small-Diameter/High-Aspect-Ratio Plated-Through-Holes and Vias".

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]

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