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October 1997

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Subject:
From:
Bab-Hui Lee-CTUA065 <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 1 Oct 1997 20:03:13 -0500
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Anyone has experience in processing PCB which calls for both immersion gold
finish & selective hard gold finish on fingers... is it easier do hard gold
plating first, then mask the fingers & go for e'less Ni/imm Au or the
reverse? What are the potential issues/problems expected??

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