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October 1997

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Subject:
From:
Martin Farrell <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 16 Oct 1997 11:27:43 +0000
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TEXT/PLAIN
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TEXT/PLAIN (30 lines)
Apologies if this is the second time you've received this message.

Ron,
       Do you regularly check the Ni concentration of the electroless solution?
Whenever I seen this problem in the past, the Ni concentration was always under
70% of the spec for the bath (optimum conc. was 5.6g/l). If you are using a Pd
catalyst, the Cu pads etc. should have a dull grey layer of Pd on the surface
(after the boards have been through the line) since no Ni has adhered to the
pad surface (due to low concentration). As the concentration decreases the more
pads, and ultimately more boards, are affected. (This information can only be
found out working beside a manufacturing manager who had very limited technical
knowledge!).
I hope this helps.

Martin Farrell (Chemist)
GEC-Marconi Avionics,
Edinburgh.

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