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October 1997

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Subject:
From:
Rick Haynes <[log in to unmask]>
Reply To:
Rick Haynes <[log in to unmask]>
Date:
Wed, 1 Oct 1997 17:33:51 -0700
Content-Type:
Multipart/Mixed
Parts/Attachments:
text/plain (1396 bytes) , ATTRIBS.BND (4 kB)
We use a product called "PACOVIA" from the Paper Corporation of America, I
believe.  This is a plastic sheet which seals the top of the panel when resin
is flowing from the bottom side.  It works well but does leave some residue on
the epoxy surface.  Contact me directly if you wish to discuss it more.

Respectfully, Rick Haynes
              [log in to unmask]

------------------
Original text

From: "Stone, Steve" <[log in to unmask]>, on 10/1/97 12:15 PM:
Greetings All,
    I'm looking for a more effective and cost efficient method of
blocking resin squeeze up hole barrels on sequentially laminated
multilayer PCB's.  Any and all suggestions are greatly appreciated.

Steve Stone
Process Engineer
Altron, Inc.
978-933-1735
[log in to unmask]

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