Hi Dan,

Is this the paper published by Judith Glazer of Hewlett-Packard ?
Can I have it as well ?

Thanks.

Yee Seng Gan
Technical Service Engineer
Tamura Kaken Singapore
Tel : 65-779-3100
Fax : 65-778-2186

P.S. Access code over in the US should be 011
----------
> From: Dan Babcock <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [TECHNET] Brittle Solder Joints  N
> Date: Thursday, October 16, 1997 6:56 AM
>
> Hi Christina -- The paper entitled 'Effect Of Au On The Reliability Of
> Fine Pitch Surface Mount Solder Joints" from the 1991 SMI Proceedings may
> provide some helpful information. I can Fax a copy if you'd like.
>
> Dan Babcock
> Sr. Engineer
> Maxtor Corp
> [log in to unmask]
>
> >Subject: Brittle Solder Joints
> >
> >Hello,
> >
> >I am looking for some information either from experience or papers on
> >what causes brittle solder joints.  We have immersion gold over nickel
> >and use eutectic solder paste. Board material is high-temp FR4.   I
> >would like to know:
> >
> >1.  How many heat cycles a solder joint will tolerate without becoming
> >brittle.  Is there a temp that a solder joint becomes brittle and the
> >crystalline structure changes (as in steel tempering)?
> >2.  What would be the definition of a heat cycle (would it be reaching
> >183 C or something else)?
> >3.  What is a safe temp to have boards at  during a stress testing..
> >
> >any information or a contact to find information would be greatly
> >appreciated.
> >Thanks in advance for your help,
> >
> >Christina Piasky ([log in to unmask])
> >Sequent Computer Systems
>
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