Hi Steve,
Sorry, but I did not see 'the att memo on PC card burnin' that you are
referring to.
Generally, however, a Burn-In on a populated PC card is a "generalized shack,
rattle, and roll" that may show something for assemblies that have some
manufacturing problems--for good assemblies a Burn-In should show nothing at
all and can be discontinued for mature product with mature processing in
place. Therefore, by its very nature there can be no such thing as
'experimental results', since the experience people have is highly specific
to their product and production. The same can be said about 'times and
temperature profiles' to be used in Burn-In; they should be essentially the
most severe use conditions, perhaps in combination, for the product. Burn-In
should not be confused with an Environmental Stress Screen--it is NOT an ESS!
An effective ESS should be performed only on suspect product and needs to be
carefully designed to stress the suspected latent defects to failure prior to
shipping to a customer.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]

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