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October 1997

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Subject:
Re: ***Stress Test Barrel**********
From:
mhu <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 15 Oct 1997 18:07:01 PST
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     You need a finite element program to do that.  There have been efforts
     in this area but the dimension is probably not the same.  One article
     that I can remember is published by a group of engineers at Compaq in
     the ISHM journal of microcircuits & electronic packaging, 2 years ago?
     (Sorry, my copy was borrowed and never returned to me.)

     Mason Hu


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Subject: [TECHNET] ***Stress Test Barrel**********
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