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October 1997

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Subject:
Re: Land to Lead Ratio
From:
Yvon Hache <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 15 Oct 1997 21:53:10 -0700
Content-Type:
text/plain
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text/plain (33 lines) 
We try not to have a large trace going to a small pad nor having many
traces connecting around a pad to either reduce risk that solder escapes
from the pad or heat dissipation during reflow.  It also helps during
rework.  For example, if a power net with 25 mils trace width goes to a
pull-up resistor 0805, we will reduce the trace width to 8 or 10 mils
before reaching the resistor's pad.  We still keep in mind the minimum
trace width necessary for the current flow as per IPC specs.

Hope this will help you.

Yvon Hache, P. Eng.
Concept + Inc.
P.O. Box 1287
Moncton, NB
E1C 8P9

Tel: 506-858-4153 ext 104
Fax: 506-858-4075
E-mail: [log in to unmask]
Web: www.concept-plus.com

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