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October 1997

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Subject:
From:
Charles Barker <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 15 Oct 1997 16:59:23 -0500
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Charles Barker@IO-US
10/15/97 04:59 PM

American Pacific Associates
304 Dunwoody Chace NE
Atlanta, GA 30328-4587
770-804-0044
770-391-9590
770-391-9593 FAX
Mr. Ted Bova

These folks handle the RP system to protect against oxidation of electronic
parts. I have not used this product. I only happen to have asked for info
from them and still have it in my files.

Good luck.




Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Charles Barker/IO-US)
Subject:  [TECHNET] ASSY -OSP-Preserving Solderability




  Hello!
  I am looking for a good method for storing OSP PC assemblies that have
been
  subjected to one selective solder reflow. The concern is with the
  solderability of remaining OSP coated surfaces. Obviously we need to do
  testing of different storage conditions. The requirement is to store
these
  assemblies for 12 weeks or more. Has anyone experience with preserving
  solderability of OSP boards after thermal cycles?
  As an example, will an oxidation arrest paper work?
  It is a good alternative to a nitrogen atmosphere when storing bare
copper.
  Can anyone tell me where to obtain oxidation arrest paper?
  Thanks

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