Hello!

  I am looking for a good method for storing OSP PC assemblies that have been
  subjected to one selective solder reflow. The concern is with the
  solderability of remaining OSP coated surfaces. Obviously we need to do
  testing of different storage conditions. The requirement is to store these
  assemblies for 12 weeks or more. Has anyone experience with preserving
  solderability of OSP boards after thermal cycles?

  As an example, will an oxidation arrest paper work?
  It is a good alternative to a nitrogen atmosphere when storing bare copper.

  Can anyone tell me where to obtain oxidation arrest paper?

  Thanks

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