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Reply To: | TechNet Mail Forum. |
Date: | Wed, 15 Oct 1997 11:16:10 -0700 |
Content-Type: | text/plain |
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Hello,
I am looking for some information either from experience or papers on
what causes brittle solder joints. We have immersion gold over nickel
and use eutectic solder paste. Board material is high-temp FR4. I
would like to know:
1. How many heat cycles a solder joint will tolerate without becoming
brittle. Is there a temp that a solder joint becomes brittle and the
crystalline structure changes (as in steel tempering)?
2. What would be the definition of a heat cycle (would it be reaching
183 C or something else)?
3. What is a safe temp to have boards at during a stress testing..
any information or a contact to find information would be greatly
appreciated.
Thanks in advance for your help,
Christina Piasky ([log in to unmask])
Sequent Computer Systems
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