David,
Very interesting.  What would be the reasoning for not using silver-filled
epoxy with tin or solder surfaces?

Glenn Pelkey
Quality/Reliability Engineer

"D.C.Whalley" <[log in to unmask]> Wrote:
|
| At 15:15 13/10/97 -0400, you wrote:
| >What is recommended surface prep for a freshly tinned
| wire prior to adhesive
| >bonding using a heat cured silver filled epoxy?
| >
| >thanks for any suggestions!
|
| The general rule for using silver filled epoxys is not to
| use them with tin or
| solder finishes. Some manufacturers do market materials
| designed to work with
| them and I have also talked to people who have had success
| with other materials
| by very carefully controlling the curing process so that
| the solder layer just
| briefly melts, but if you can switch to another finish on
| the wire you are less
| likely to have problems.
|
| David Whalley
|
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