TECHNET Archives

October 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Phillip Ingram <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 14 Oct 1997 16:58:39 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines)
        I would appreciate some information on  models of X-Ray Inspection
Equipment
that is being used to inspect Micro BGA solder connections.  My company has
been building
surface mount assemblies down to 15mil pitch for several years and is
investigating Micro BGA
devices for Flash Memory.

        To keep from flooding the TechNet, responses may be directed to me at:

                [log in to unmask]

        Any response will be appreciated.

                                                Thank you!

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2