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October 1997

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Date:
Wed, 1 Oct 1997 16:40:55 -0400
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Hi Dwayne,
Why do you expect that a switch from HASL to gold immersion would improve the
solder joint reliability of our 20mil components? I am not aware of anything
in this switch that would affect solder joint reliability, with the exception
that in case you plate too much Au you could get 'gold embrittlement' of the
solder joints and therefore lower reliability. Perhaps you have some quality
problems with your
 HASL process? But you did not mention them.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]

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