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October 1997

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Subject:
Re: FAB: surface prep for bonding
From:
"D.C.Whalley" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 14 Oct 1997 10:31:13 -0400
Content-Type:
text/plain
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text/plain (27 lines) 
At 15:15 13/10/97 -0400, you wrote:
>What is recommended surface prep for a freshly tinned wire prior to adhesive
>bonding using a heat cured silver filled epoxy?
>
>thanks for any suggestions!

The general rule for using silver filled epoxys is not to use them with tin or
solder finishes. Some manufacturers do market materials designed to work with
them and I have also talked to people who have had success with other materials
by very carefully controlling the curing process so that the solder layer just
briefly melts, but if you can switch to another finish on the wire you are less
likely to have problems.

David Whalley

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