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October 1997

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Subject:
FAB: surface prep for bonding
From:
Sheila Smith <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 13 Oct 1997 15:15:48 -0400
Content-Type:
text/plain
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text/plain (17 lines) 
What is recommended surface prep for a freshly tinned wire prior to adhesive
bonding using a heat cured silver filled epoxy?

thanks for any suggestions!

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