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October 1997

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sun, 12 Oct 1997 19:10:44 -0500
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HI TechNet - I am looking for some information. During the ANSIJ -STD-003
committee meeting last week the question came up about "At what feature
dimension do you increase your inspection magnification?" concerning the
solderability of plated thru holes and surfaces. In ANSIJ-STD-002 for
components the inspection magnification goes from 10x to 30x for 0.5mm
pitch (25 mil for those metrically impaired) and smaller. I believe that
the same principle is being used on solderability inspection for pwbs. Now
my question - at what feature size do you increase your inspection
magnification? Please email me your responses so the information can be
directed back into the 003 committee. I'll post the results on TechNet once
they are accumulated.

Dave Hillman
ANSIJ-STD-003 committee Chairman
[log in to unmask]

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