Hi TechNet -

1# - If you control the reflow time and temperature you will not have a
gold embrittlement problem. Do a microsectional and scanning electron
microscopy analysis to confirm your process settings (and use the test
results as process documentation/confirmation to answer any customer
questions).

#2 -You might try placing a fluxed preform on the gold area and run the
component thru a reflow oven. This way you can pretin a large quantity of
components in one pass and control the amount of thermal exposure the
component is subjected to. Good Luck.

Dave Hillman
Rockwell Collins
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[log in to unmask] on 10/09/97 12:52:00 PM

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cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TECHNET] ASSY: SOLDERING TO GOLD




          We've got a few different RF surface mount components (amplifier,
          mixer ect.)that need to have the bottom surface of the component
          soldered directly to the ground plane of the surface mount board.
          This is necessary for proper electrical performance.  The parts
are
          packaged on tape & reel for pick & place assembly.  The component
          leads are pretinned, but the bottom of the components are gold
          plated, approx 50 microinches.
          Two questions:
          1.   Can we get away without removing the gold from the bottom of
               the components?
          2.   What's the best way to pretin the bottom of the component,
               approx .5" square?
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